? Support up to 230W+ TDP
? High pressure blade design (max. 3.07 mm-H2O)
? Patented Rotatable Air Guide
? Support addressable RGB motherboard sync
? Plug & Play to display the rainbow RGB lighting effect,
no software or adaptor needed

ETS-T50 AXE ARGB series is a side-flow CPU air cooler, supporting 230W+ TDP and synchronizing with addressable RGB enabled motherboards. Equipped with patented Air Guide allows users to adjust airflow direction to enhance the system's cooling performance; the attached high pressure blade fan can generate stronger airflow to cool down the heatsink rapidly. The heatsink is characterized with patented Vortex Generation Flow (VGF) design and Pressure Differential Flow (PDF) design to create dynamic airflow and increase heat dissipation. ETS-T50 AXE ARGB further provides plug & play function to display vivid rainbow RGB lighting effect by simply connecting a PWM power cable.

Feature

Luminous addressable RGB fan delivers 16.8 million colors with dynamic lighting effects

Support Addressable RGB lighting synchronization via motherboard

Users can sync the RGB lighting with motherboards featuring Addressable RGB header (4-pin assignment: 5V/D/-/G) and control lighting effects directly from ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync and ASRock Polychrome

Plug & Play to display rainbow RGB lighting effects

Users can use the PWM power cable to connect the fan to create constant rainbow RGB lighting effects, no software or adaptor needed

High Pressure Technology

High pressure blade design is a precision engineering of the blade angle and shape calculation. The blades centralize dispersed airflow to the center of the fan and create extremely high air pressure high airflow while maintaining outstanding quietness

Patented Air Guide with rotatable grill

Patented Air Guide with rotatable grill for preferred airflow direction

Patented Pressure Differential Flow (PDF) design

Patented Pressure Differential Flow (PDF) design uses differential wind pressure to increase 15% more airflow

Patented Vortex Generation Flow (VGF) design

Patented Vortex Generation Flow (VGF) design to increase air convection around the heat pipe

Unique air path creating high Vacuum Effect (VEF) to optimize airflow

Heat-pipe Direct Touch (HDT) technology to ensure rapid thermal conduction and eliminate CPU hot spots

Asymmetric heat pipe design allows extra space for ideal RAM compatibility